• Applied in many fields, especially the production of electronic components, microchips, electrical engineering, telephones... used for quick fixation of components after irradiation, bringing high durability;
• Especially for quick fixation of components that need to be cured at low temperature;
• Cured products are generally used in the temperature range of -40°C to +130°C; depending on the application, other limits may be more reasonable;
• Complies with RoHS directive 2015/863/EU;
• Halogen-free according to the criteria of IEC 61249-2-21;
• Compliant VOC content limit according to GB33372-202 criteria.

• This adhesive is suitable for two curing methods both by UV light and by humidity;
• It has medium viscosity with one component, solvent-free base on modified acrylate.

Model: MICROSTAR 1M series

Maker: Helmel – USA

Model: MICROSTAR 320-185 HS

Maker: Helmel – USA

Model: MICROSTAR

Maker: Helmel – USA

Model: Microgage

Maker: Helmel - USA

Model: HISOMET II DHII

Manufacturer:  Union – Japan

Model: THS Series

Manufacturer: Union – Japan

Model: DCM Series

Manufacturer: Union – Japan

Model: MCB Series

Manufacturer: Union – Japan

Model: M2 / M3

 This is an adhesive one component, solvent-free adhesive base on modified urethane acrylate.

 It allows users to choose between curing methods with light, heat, or moisture.

 Apply for many sectors as the production of electronic components, ICs, electrical engineering, telephones, automobiles, photovoltaics, precision engineering, used to mount materials and cover,…