• Applied in many fields, especially the production of electronic components, microchips, electrical engineering, telephones... used for quick fixation of components after irradiation, bringing high durability;
• Especially for quick fixation of components that need to be cured at low temperature;
• Cured products are generally used in the temperature range of -40°C to +130°C; depending on the application, other limits may be more reasonable;
• Complies with RoHS directive 2015/863/EU;
• Halogen-free according to the criteria of IEC 61249-2-21;
• Compliant VOC content limit according to GB33372-202 criteria.

• This adhesive is suitable for two curing methods both by UV light and by humidity;
• It has medium viscosity with one component, solvent-free base on modified acrylate.

 This is an adhesive one component, solvent-free adhesive base on modified urethane acrylate.

 It allows users to choose between curing methods with light, heat, or moisture.

 Apply for many sectors as the production of electronic components, ICs, electrical engineering, telephones, automobiles, photovoltaics, precision engineering, used to mount materials and cover,…

- This adhesive suitable for two curing methods includes visible light and humidity within seconds. It has high viscosity with one component, solvent-free base on modified acrylate, and has thixotropic.

- Especially suitable for peeling resistant bonding of membranes and coil in mini loudspeaker;

- Multipurpose for plastic/plastic, glass/plastic, metal/plastic, glass/glass, and glass/metal bondings;

• As a glue compatible with both heat and UV curing, it has low air release, low shrinkage, and low CTE;
• Ingredients: modified epoxy resin, 1-component glue, solvent-free;
• High viscosity, catalytic properties (Thixotropy);
• Used for bonding between materials such as metal, glass, plastic as well as casting, fixing, or mounting around electronic components;
• Operating temperature: -40 ⁰ C ~ 150 ⁰ C, depending on the application;
• RoHS compliant 2015/863/EU, Halogen-free according to IEC 61249-2-21;
• Meets the VOC limit for adhesives according to the GB33372-2020 regulation.

• This adhesive is suitable for both curing methods by UV light and by the heat addition;
• It’s just one component base on modified polycarbamine acid with dual curing features.

• It is an epoxy glue that cures at low temperatures, used for bonding temperature-sensitive sensors, camera modules, etc.
• Adhesive meets halogen-free standards according to IEC 61248-2-21 regulations;
• Meets RoHS 2015/863/EU standards;
• Glue can be dispersed using robot systems with needle tips.
• Operating temperature: -40 0C ~ 150 0C, depending on application;
• Meets volatile organic matter (VOC) content limit standards according to GB33372-2020;
• Meets DIN EN ISO 10993-5: cytotoxicity test.

• This is the glue that is compatible with both UV light and low temperature curing methods (+80^oC);
• The ingredient is just one component based on polycarbaminacid being modified, non-solvent.
• Non-halogen by the criteria of IEC 61248-2-21;
• Compliant with RoHS 2015/863/EU;
• The adhesive is supplied ready to use, to achieve the best performance, it can be dispensed by injection systems or use metal injection needles.