DELO DUALBOND OB786 Adhesive for microcircuit | HUST VN

DELO DUALBOND OB786 Adhesive for microcircuit

lien_he

  • As a glue compatible with both heat and UV curing, it has low air release, low shrinkage, and low CTE;
  • Ingredients: modified epoxy resin, 1-component glue, solvent-free;
  • High viscosity, catalytic properties (Thixotropy);
  • Used for bonding between materials such as metal, glass, plastic as well as casting, fixing, or mounting around electronic components;
  • Operating temperature: -40 0 C ~ 150 0 C, depending on the application;
  • RoHS compliant 2015/863/EU, Halogen-free according to IEC 61249-2-21;
  • Meets the VOC limit for adhesives according to the GB33372-2020 regulation.

Introduce:

  • As a glue compatible with both heat and UV curing, it has low air release, low shrinkage, and low CTE;
  • Ingredients: modified epoxy resin, 1-component glue, solvent-free;
  • High viscosity, catalytic properties (Thixotropy);
  • Used for bonding between materials such as metal, glass, plastic as well as casting, fixing, or mounting around electronic components;
  • Operating temperature: -40 0 C ~ 150 0 C, depending on the application;
  • RoHS compliant 2015/863/EU, Halogen-free according to IEC 61249-2-21;
  • Meets the VOC limit for adhesives according to the GB33372-2020 regulation.

ob786.  1

Actual photo of DUALBOND OB786 glue bottle (HUST photo)

Application:

  • Applied in many fields, especially the production of electronic components, microchips, electrical engineering, telephones... used to quickly fix components after irradiation, bringing high durability.
  • In order to use the adhesive effectively, it is recommended to place the glue in the DELO special dispersant, the surface to be bonded should be clean, dry, free of dust or grease.
  • For a clean and well-activated surface, use the DELOTHEN surface cleaner.
  • Use DELOTHEN EP for more cleaning on glass surfaces.
  • Use the DELOMAT 100 gluing system and G30 or higher dispensing needle.

Curing: 

  • Using a UV lamp with a wavelength of 365nm. In the shadowed area, the glue can be heat dried in the range of 80~130 0 C. Both of the above methods can be used independently.
  • Refer to the standard wavelength range of DELOLUX 20/50/80 lamps:

Lamp Type

DELOLUX 20/50/80

Wavelength Range  (nm)

365

400

460

Suitability

++

-

-

Irradiation time (150 mW/cm 2 , 365nm)

4 s

Drying time in the air convection oven

80 o C

100oC

130oC

50 min

25 min

10 min

Note: ++ particularly suitable, + suitable, - not suitable

 

Specifications:

 

Color (in 1.0 mm layer thickness glue):

yellow, translucent

Density:

1.6 g/cm3

Viscosity (Rheometer | Shear rate: 10 1/s | Gap: 500 µm):

32000 mPas

Thixotropy index:

7

Filler particles type:

Inorganic minerals

Filler particles size:

d95 = 12 µm

Filler particles content:

55 %wt.

Maximum adhesive layer that can be cured:

0,76 mm

Glue surface after curing:

Hard dry

Compression shear strength (MPa)

Al/Al (anodized)

41 MPa

FR4/FR4

27 MPa

Glass/glass

20 MPa

PPS/PPS

33 MPa

Tensile strength:

41 MPa

Elongation at tear:

0,8 %

Young's modulus:

7500 MPa

Shore D hardness:

>90

Glass transition temperature:

1790C

Coefficient of thermal expansion CTE

in the range 30~80 0 C:

38 ppm/K

in the range 130~150 0 C:

53 ppm/K

Shrinkage:

1,6 %vol.

Water Absorption:

0,08 %wt.

Processing time (at 25 o C):

30 days

Storage time:

6 months, stored at -45 ~ -15 0 C with the unopened container.

 

Contact HUST Vietnam for more detailed information. 

HUST Vietnam is proud to be the exclusive distributor of glue, dispensing equipment, UV glue curing lamps, and technology transfer from DELO in Vietnam!

Bình luận

HOT

DELO DUALBOND RE3440 Adhesive for camera

1 VND

  • Applied in many fields, especially the production of electronic components, microchips, electrical engineering, telephones... used for quick fixation of components after irradiation, bringing high durability;
  • Especially for quick fixation of components that need to be cured at low temperature;
  • Cured products are generally used in the temperature range of -40°C to +130°C; depending on the application, other limits may be more reasonable;
  • Complies with RoHS directive 2015/863/EU;
  • Halogen-free according to the criteria of IEC 61249-2-21;
  • Compliant VOC content limit according to GB33372-202 criteria.
Buy
HOT

DELO DUALBOND AD4950 - Electronic Adhesive

lien_he

  • This adhesive is suitable for two curing methods both by UV light and by humidity;
  • It has medium viscosity with one component, solvent-free base on modified acrylate.

DELO DUALBOND AD465 Adhesive

lien_he

 This is an adhesive one component, solvent-free adhesive base on modified urethane acrylate.

 It allows users to choose between curing methods with light, heat, or moisture.

 Apply for many sectors as the production of electronic components, ICs, electrical engineering, telephones, automobiles, photovoltaics, precision engineering, used to mount materials and cover,…

DELO DUALBOND MF4992

lien_he

- This adhesive suitable for two curing methods includes visible light and humidity within seconds. It has high viscosity with one component, solvent-free base on modified acrylate, and has thixotropic.

- Especially suitable for peeling resistant bonding of membranes and coil in mini loudspeaker;

- Multipurpose for plastic/plastic, glass/plastic, metal/plastic, glass/glass, and glass/metal bondings;

DELO DUALBOND AD345 Adhesive

lien_he

  • This adhesive is suitable for both curing methods by UV light and by the heat addition;
  • It’s just one component base on modified polycarbamine acid with dual curing features.
HOT

DELO DUALBOND GE4949 - Adhesive for camera

lien_he

- DELO DUALBOND GE4949 is a modified acrylate adhesive that cures by UV and air humidity in just a few seconds;

- Glue has good tensile-equalizing thanks to its high elongation at tear;

- Compliant RoHS standards according to 2015/863/EU;

- Compliant with VOC content limit according to GB33372-202 regulation.

HOT

DELO DUALBOND LT2266 sensor adhesive

lien_he

  • It is an epoxy glue that cures at low temperatures, used for bonding temperature-sensitive sensors, camera modules, etc.
  • Adhesive meets halogen-free standards according to IEC 61248-2-21 regulations;
  • Meets RoHS 2015/863/EU standards;
  • Glue can be dispersed using robot systems with needle tips.
  • Operating temperature: -40 0C ~ 150 0C, depending on application;
  • Meets volatile organic matter (VOC) content limit standards according to GB33372-2020;
  • Meets DIN EN ISO 10993-5: cytotoxicity test.
HOT

DELO DUALBOND LT3411 - Adhesive for camera module

lien_he

  • This is the glue that is compatible with both UV light and low temperature curing methods (+80oC);
  • The ingredient is just one component based on polycarbaminacid being modified, non-solvent.
  • Non-halogen by the criteria of IEC 61248-2-21;
  • Compliant with RoHS 2015/863/EU;
  • The adhesive is supplied ready to use, to achieve the best performance, it can be dispensed by injection systems or use metal injection needles.