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DELO DUALBOND OB786 Adhesive for microcircuit

DELO DUALBOND OB786 Adhesive for microcircuit

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  • As a glue compatible with both heat and UV curing, it has low air release, low shrinkage, and low CTE;
  • Ingredients: modified epoxy resin, 1-component glue, solvent-free;
  • High viscosity, catalytic properties (Thixotropy);
  • Used for bonding between materials such as metal, glass, plastic as well as casting, fixing, or mounting around electronic components;
  • Operating temperature: -40 0 C ~ 150 0 C, depending on the application;
  • RoHS compliant 2015/863/EU, Halogen-free according to IEC 61249-2-21;
  • Meets the VOC limit for adhesives according to the GB33372-2020 regulation.