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DELO OB6769 Adhesive for camera module

DELO OB6769 Adhesive for camera module

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  • An adhesive that is compatible with both thermal and UV curing methods;
  • One component adhesive is derived from modified epoxy resin, free-bisphenol A, nonylphenols, CFC / HFC, and solvent-free.
  • Range of use temperature: -40 0C ~ 180 0C, depending on the certain application;
  • Especially for components of the camera module;
  • Combined bonding between PC, PPS, FR4 resins, metal with plastic, metal with metal such as Al / Al, steel/steel,… as well as temperature-sensitive components;
  • Fast fixation of components and details.